1. Fan Out Packaging Materials and Equipment Market
1.1 Definitions and Scope
2. Fan Out Packaging Materials and Equipment Market – Executive Summary
2.1 Market Revenue, Market Size and Key Trends by Company
2.2 Key trends By Industry
2.3 Key trends segmented by Geography
3. Fan Out Packaging Materials and Equipment Market – Market Landscape
3.1 Comparative Analysis
3.1.1 Product/Company Benchmarking-Top 5 Companies
3.1.2 Top 5 Financial Analysis
3.1.3 Market Value Split by Top 5 Companies
3.1.4 Patent Analysis
4. Fan Out Packaging Materials and Equipment Market – Market Forces
4.1 Market Drivers
4.2 Market Constraints
4.3 Porters five force model
4.3.1 Bargaining power of suppliers
4.3.2 Bargaining powers of customers
4.3.3 Threat of new entrants
4.3.4 Rivalry among existing players
4.3.5 Threat of substitutes
5. Fan Out Packaging Materials and Equipment Market – By Strategic Analysis
5.1 Value Chain Analysis
5.2 Opportunities Analysis
5.3 Product Life Cycle/Market Life Cycle Analysis
5.4 Suppliers and Distributors (5 Key Suppliers and Their Relevant Distributors)
6. Fan Out Packaging Materials and Equipment Market – By Process Type (Market Size -$Million/Billion)
6.1 Carrier bonding & debonding
6.2 Pick & Place
6.3 RDL Passivation
6.4 Others
7. Fan Out Packaging Materials and Equipment Market – By Type (Market Size -$Million/Billion)
7.1 Core Fan-out
7.2 High-density fan-out
7.3 Ultra high density fan-out
8. Fan Out Packaging Materials and Equipment Market – By Business Model (Market Size -$Million/Billion)
8.1 OSAT
8.2 Foundry
8.3 FDM
9. Fan Out Packaging Materials and Equipment Market – By Application (Market Size -$Million/Billion)
9.1 PMICs, RF Transceivers
9.2 Connectivity Modules
9.3 Audio/Codec Modules
9.4 Radar Modules & Sensors
9.5 Others
10. Fan Out Packaging Materials and Equipment Market – By Geography (Market Size -$Million/Billion)
10.1 North America
10.1.1 U.S
10.1.2 Canada
10.1.3 Mexico
10.2 South America
10.2.1 Brazil
10.2.2 Argentina
10.2.3 Chile
10.2.4 Colombia
10.2.5 Others
10.3 Europe
10.3.1 Germany
10.3.2 France
10.3.3 UK
10.3.4 Italy
10.3.5 Spain
10.3.6 Russia
10.3.7 Netherlands
10.3.8 Others
10.4 APAC
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 India
10.4.5 Australia
10.4.6 Indonesia
10.4.7 Malaysia
10.4.8 Others
10.5 RoW
10.5.1 Middle East
10.5.2 Africa
11. Fan Out Packaging Materials and Equipment Market – Market Entropy
11.1 New product launches
11.2 M&A’s, collaborations, JVs and partnerships
12. Fan Out Packaging Materials and Equipment Market – Company Analysis (Market , Product Portfolio, Revenue, Developments)
12.1 SAKOR Technologies
12.2 AVL List GmbH
12.3 Taylor Fan Out Packaging Materials and Equipment
12.4 Dynomerk Controls
12.5 Froude, Inc.
12.6 Company 6
12.7 Company 7
12.8 Company 8
12.9 Company 9
12.8 Company 10
“*Financials would be provided on a best-efforts basis for private companies”
IndustryARC
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Report Description
Overview
팬 아웃 패키징 재료 및 장비 시장을 분석하며, 시장 규모, 매출, 주요 기업, 산업 및 지리별 주요 트렌드를 중점으로 다룹니다. 경쟁 분석과 포터의 5가지 힘 모델을 제공합니다.
Segment
시장 동력, 가치 사슬 분석, 공정 유형(캐리어 본딩, 픽 앤 플레이스, RDL 패시베이션) 및 응용 프로그램 유형(PMIC, RF 송수신기, 레이더 모듈)을 세분화합니다. 지리적 세분화는 북미, 유럽, APAC, 남미로 이루어집니다.
Key Takeaways
반도체 산업에 중점을 둔 시장 동인과 제약을 식별합니다. 캐리어 본딩 및 픽 앤 플레이스 공정에서의 기회를 강조하고 주요 기업의 제품 벤치마킹, 시장 점유율 및 특허 분석을 제공합니다.