1. Fan Out Packaging Materials and Equipment Market Overview
1.1 Definitions and Scope
2. Fan Out Packaging Materials and Equipment Market – Executive Summary
2.1 Market Revenue, Market Size and Key Trends by Company
2.2 Key trends By Industry
2.3 Key trends segmented by Geography
3. Fan Out Packaging Materials and Equipment Market – Market Landscape
3.1 Comparative Analysis
3.1.1 Product/Company Benchmarking-Top 5 Companies
3.1.2 Top 5 Financial Analysis
3.1.3 Market Value Split by Top 5 Companies
3.1.4 Patent Analysis
4. Fan Out Packaging Materials and Equipment Market – Market Forces
4.1 Market Drivers
4.2 Market Constraints
4.3 Porters five force model
4.3.1 Bargaining power of suppliers
4.3.2 Bargaining powers of customers
4.3.3 Threat of new entrants
4.3.4 Rivalry among existing players
4.3.5 Threat of substitutes
5. Fan Out Packaging Materials and Equipment Market – By Strategic Analysis
5.1 Value Chain Analysis
5.2 Opportunities Analysis
5.3 Product Life Cycle/Market Life Cycle Analysis
5.4 Suppliers and Distributors (5 Key Suppliers and Their Relevant Distributors)
6. Fan Out Packaging Materials and Equipment Market – By Process Type (Market Size -$Million/Billion)
6.1 Carrier bonding & debonding
6.2 Pick & Place
6.3 RDL Passivation
6.4 Others
7. Fan Out Packaging Materials and Equipment Market – By Type (Market Size -$Million/Billion)
7.1 Core Fan-out
7.2 High-density fan-out
7.3 Ultra high density fan-out
8. Fan Out Packaging Materials and Equipment Market – By Business Model (Market Size -$Million/Billion)
8.1 OSAT
8.2 Foundry
8.3 FDM
9. Fan Out Packaging Materials and Equipment Market – By Application (Market Size -$Million/Billion)
9.1 PMICs, RF Transceivers
9.2 Connectivity Modules
9.3 Audio/Codec Modules
9.4 Radar Modules & Sensors
9.5 Others
10. Fan Out Packaging Materials and Equipment Market – By Geography (Market Size -$Million/Billion)
10.1 North America
10.1.1 U.S
10.1.2 Canada
10.1.3 Mexico
10.2 South America
10.2.1 Brazil
10.2.2 Argentina
10.2.3 Chile
10.2.4 Colombia
10.2.5 Others
10.3 Europe
10.3.1 Germany
10.3.2 France
10.3.3 UK
10.3.4 Italy
10.3.5 Spain
10.3.6 Russia
10.3.7 Netherlands
10.3.8 Others
10.4 APAC
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 India
10.4.5 Australia
10.4.6 Indonesia
10.4.7 Malaysia
10.4.8 Others
10.5 RoW
10.5.1 Middle East
10.5.2 Africa
11. Fan Out Packaging Materials and Equipment Market – Market Entropy
11.1 New product launches
11.2 M&A’s, collaborations, JVs and partnerships
12. Fan Out Packaging Materials and Equipment Market – Company Analysis (Market Overview, Product Portfolio, Revenue, Developments)
12.1 SAKOR Technologies
12.2 AVL List GmbH
12.3 Taylor Fan Out Packaging Materials and Equipment
12.4 Dynomerk Controls
12.5 Froude, Inc.
12.6 Company 6
12.7 Company 7
12.8 Company 8
12.9 Company 9
12.8 Company 10
“*Financials would be provided on a best-efforts basis for private companies”
IndustryARC
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Report Description
Overview
팬아웃 패키징 시장은 반도체 산업에서 고밀도 집적 회로 설계와 열 관리를 위해 사용되는 필수 기술입니다. 이 기술은 스마트폰, IoT 디바이스, RF 모듈과 같은 고성능 애플리케이션에서 주요한 역할을 합니다.
Segment
주요 공정은 캐리어 접합 및 분리, 픽앤플레이스, RDL 패시베이션 등이 포함되며, 제품 유형은 코어, 고밀도, 초고밀도 패키징으로 나뉩니다. 주요 애플리케이션은 PMIC, RF 트랜시버, 레이더 모듈, 오디오 코덱 모듈 등이 있으며, 지역적으로는 APAC, 북미, 유럽이 주요 시장입니다.
Key Takeaways
전자 기기의 소형화와 고성능 요구로 인해 Fan-out 패키징 기술의 수요가 지속적으로 증가하고 있습니다. 특히 IoT와 5G 기술 확산으로 인해 RF 모듈과 같은 고밀도 애플리케이션에서 이 기술의 중요성이 부각되고 있습니다.